YANG, Zihan; JIA, Xuguo. Reliability Assessment of Cu-Al Wire Bonds under Thermal Aging: An Investigation of Interfacial Degradation and Mechanical Failure. Journal of Computer, Signal, and System Research, [S. l.], v. 2, n. 5, p. 72–78, 2025. DOI: 10.71222/2m44cn43. Disponível em: http://www.gbspress.com/index.php/JCSSR/article/view/418. Acesso em: 11 oct. 2025.